Purpose and Required Conditions for Thermal Shock Testing Machine

The thermal shock testing machine is suitable for research institutions, universities, factories, military industries, and other organizations to test the adaptability of electrical and electronic products, semiconductors, circuit boards, metal materials, bearings, and various other materials under rapid temperature changes. Linpin’s testing chambers have been widely adopted by institutions such as Xiamen University, Shanghai Jiao Tong University, China University of Mining and Technology, and Dalian University of Technology. Additionally, Linpin frequently collaborates with domestic and international enterprises, expanding its application scope and increasing familiarity with its testing equipment. Below are the test purpose, conditions, and recovery requirements:

Thermal Shock Testing Machine

1. Test Purpose:
   To determine the adaptability and potential damage of test specimens when exposed to sudden changes in ambient temperature.

2. Test Conditions:

   • High-temperature chamber: RT ~ 150°C
   • Low-temperature chamber: RT ~ -40°C
   • Temperature dwell time: 1 hour or until the specimen reaches thermal stability, whichever is longer.
   • Cycle count: Varies depending on industry and manufacturer standards; testing should be conducted according to the specified method.

3. Recovery:
   After removal from the thermal shock chamber, the test specimen should be allowed to stabilize under normal test atmospheric conditions until it reaches thermal equilibrium.

The above is an overview of the thermal shock testing process. If you need to purchase a thermal shock testing machine or other equipment, Linpin is an excellent choice. The company offers a comprehensive range of devices—there’s nothing Linpin can’t provide when it comes to testing solutions.